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SOLDERING & SURFACE MOUNT TECHNOLOGY
ISSN：0954-0911

SOLDERING & SURFACE MOUNT TECHNOLOGY

SOLDER SURF MT TECH
学科领域：材料科学
是否预警：不在预警名单内
是否OA：否
录用周期：>12周，或约稿
新锐分区：材料科学3区
年发文量：39
影响因子：1.8
JCR分区：Q2
投稿链接：

基本信息

焊接和表面贴装技术致力于在这一重要领域的知识和专业技术体系内为研究和应用的进步做出重要贡献。《焊接与表面安装技术》对其姊妹出版物的赞扬《电路世界》和《微电子国际》。该杂志涵盖了SMT的各个方面，从合金、锡膏和助焊剂到可靠性和环境影响，目前正在为无铅焊料和工艺的新知识提供重要的传播途径。该杂志包括一个多学科研究的关键材料和技术，用于组装国家的最先进的功能电子设备。重点是通过焊接组装器件和互连组件，同时还包括广泛的相关方法。
0954-0911SCIE/Scopus收录
1.8
点击查看最新影响趋势>
2
新
2026年3月发布
点击查看历史分区趋势    >
大类学科小类学科Top期刊综述期刊
材料科学3区
ENGINEERING, MANUFACTURING 工程：制造
4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
4区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合
4区
METALLURGY & METALLURGICAL ENGINEERING 冶金工程
3区
否
N/A
新
WOS期刊SCI分区  2024-2025最新升级版
按JIF指标学科分区收集子录JIF分区JIF排名百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC
SCIE
Q3
240/368
学科：ENGINEERING, MANUFACTURING
SCIE
Q4
59/71
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY
SCIE
Q4
349/461
学科：METALLURGY & METALLURGICAL ENGINEERING
SCIE
Q2
47/97
按JCR指标学科分区收集子录JCR分区JCR排名百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC
SCIE
Q3
247/368
学科：ENGINEERING, MANUFACTURING
SCIE
Q4
54/71
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY
SCIE
Q3
310/463
学科：METALLURGY & METALLURGICAL ENGINEERING
SCIE
Q2
44/97
28
39
点击查看年发文量趋势图>
21%容易>12周，或约稿-工程技术-材料科学：综合
16.7%
点击查看自引率趋势图>
时间预警情况
2026年03月发布的新锐学术版不在预警名单中
2025年03月发布的2025版不在预警名单中
2024年02月发布的2024版不在预警名单中
2023年01月发布的2023版不在预警名单中
2021年12月发布的2021版不在预警名单中
2020年12月发布的2020版不在预警名单中
100.00%--
CiteScore：3.90
SJR：0.314
SNIP：0.726
学科类别分区排名百分位
大类：Engineering
小类：Electrical and Electronic Engineering
Q2
371 / 970
大类：Engineering
小类：Condensed Matter Physics
Q2
198 / 443
大类：Engineering
小类：General Materials Science
Q3
233 / 460

期刊高被引文献

Measurement and regulation of saturated vapour height level in VPS chamber
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-10-2018-0040
Corrosion characterization of Sn-Zn solder: a review
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-05-2018-0013
Nickel effects on the structural and some physical properties of the eutectic Sn-Ag lead-free solder alloy
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-03-2018-0009
Stress analysis and structural optimization of 3-D IC package based on the Taguchi method
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-04-2019-0016
Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-07-2018-0020
Rheology of F620 solder paste and flux
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-08-2018-0027
Stress analysis of pressure-assisted sintering for the double-side assembly of power module
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-01-2018-0005
Design of a bi-manual haptic interface for skill acquisition in surface mount device soldering
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-01-2018-0001
Filling efficiency of flip-chip underfill encapsulation process
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-07-2019-0026
Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-06-2018-0018
Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-06-2018-0019
Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-01-2019-0001
Advances in pressure sensing for vapour phase soldering process monitoring
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-10-2018-0038
Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-05-2018-0014
Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-08-2018-0024
Influence of thermal shock cycles on Sn-37Pb solder bumps
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-08-2018-0026
A method for optimizing stencil cleaning time in solder paste printing process
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-10-2018-0037
Microstructure of Sn-20In-2.8Ag solder and mechanical properties of joint with Cu
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-12-2017-0044
Study on the strength of diameter-reducing solder balls by shear and pull tests
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-09-2018-0032
Machine learning framework for predicting reliability of solder joints
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-04-2019-0013
Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-08-2018-0028
Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-04-2019-0017
Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-05-2019-0019
Vapour phase soldering (VPS) technology: a review
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-10-2018-0042
Low RH and temperature effect on 0201 sized passive components during SMT mounting
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-02-2019-0006
Transient liquid phase bonding in the Cu-Sn system
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-09-2018-0031
Experimental approach to thermal conductivity of macro solder joints with voids
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-11-2018-0050
A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-11-2018-0046
Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-11-2018-0045
Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-07-2019-0025
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-05-2019-0018
The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-11-2018-0043
Investigation on effects of solder paste voids on thermal and optical performance of white high-power surface-mounted device LEDs
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-04-2019-0014
Electro-thermal simulation and fabrication of LTCC hotplate with lead-free interconnects
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-02-2019-0007
Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-10-2018-0039
Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-08-2018-0025
Applying data mining methodology to establish an intelligent decision system for PCBA process
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-10-2018-0036
Pulse plated Sn-Cu solder coatings from stannate bath
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-08-2019-0027
The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder joints
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-03-2018-0010
Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-05-2019-0020
Investigation of anodic dissolution behaviour of intermetallic compound in Sn-3Ag-0.5Cu solder alloy by cyclic voltammetry
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-10-2018-0035
Failure analysis on cracking of blind and buried vias of printed circuit board for high-end mobile phones
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/SSMT-11-2018-0048
Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging
来源期刊：Soldering & Surface Mount TechnologyDOI：10.1108/ssmt-04-2019-0015

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ADVANCED COMPOSITE MATERIALS封面

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学科领域：材料科学
影响因子：2.3
中科院分区： 3区
APPLIED COMPOSITE MATERIALS封面

APPLIED COMPOSITE MATERIALS

学科领域：材料科学
影响因子：2.9
中科院分区： 3区
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING封面

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

学科领域：材料科学
影响因子：2.8
中科院分区： 3区
BOLETIN DE LA SOCIEDAD ESPANOLA DE CERAMICA Y VIDRIO封面

BOLETIN DE LA SOCIEDAD ESPANOLA DE CERAMICA Y VIDRIO

学科领域：材料科学
影响因子：2.7
中科院分区： 3区
论文发表 2-4个月录用 7500+文章录用 不成功可退款
新
2026年3月发布（新锐分区）
大类学科小类学科Top期刊综述期刊
材料科学3区
ENGINEERING, MANUFACTURING 工程：制造
4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
4区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合
4区
METALLURGY & METALLURGICAL ENGINEERING 冶金工程
3区
否
N/A
2025年3月升级版
大类学科小类学科Top期刊综述期刊
材料科学4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
4区
ENGINEERING, MANUFACTURING 工程：制造
4区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合
4区
METALLURGY & METALLURGICAL ENGINEERING 冶金工程
4区
否
否
2023年12月旧的升级版
大类学科小类学科Top期刊综述期刊
材料科学4区
METALLURGY & METALLURGICAL ENGINEERING 冶金工程
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
4区
ENGINEERING, MANUFACTURING 工程：制造
4区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合
4区
否
否