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IEEE Transactions on Components Packaging and Manufacturing Technology
ISSN：2156-3950

IEEE Transactions on Components Packaging and Manufacturing Technology

IEEE T COMP PACK MAN
学科领域：工程技术
是否预警：不在预警名单内
是否OA：否
录用周期：一般,3-6周
新锐分区：工程技术3区
年发文量：255
影响因子：3
JCR分区：Q2
投稿链接：

基本信息

IEEE Transactions on Components，Packaging，and Manufacturing Technology发表了有关建模、设计、构建模块、技术基础设施和分析的研究和应用文章，这些文章支持电子、光子和MEMS封装，以及无源元件、电触点和连接器、热管理和器件可靠性的新发展;以及电子部件和组件的制造，广泛覆盖设计、工厂建模、装配方法、质量、产品稳健性和环境设计。
2156-3950SCIE/Scopus收录
3
点击查看最新影响趋势>
3
新
2026年3月发布
点击查看历史分区趋势    >
大类学科小类学科Top期刊综述期刊
工程技术3区
ENGINEERING, MANUFACTURING 工程：制造
4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
3区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合
3区
否
N/A
新
WOS期刊SCI分区  2024-2025最新升级版
按JIF指标学科分区收集子录JIF分区JIF排名百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC
SCIE
Q2
158/368
学科：ENGINEERING, MANUFACTURING
SCIE
Q3
38/71
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY
SCIE
Q3
251/461
按JCR指标学科分区收集子录JCR分区JCR排名百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC
SCIE
Q2
172/368
学科：ENGINEERING, MANUFACTURING
SCIE
Q3
38/71
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY
SCIE
Q2
229/463
39
255
点击查看年发文量趋势图>
21%0一般,3-6周-ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
13.3%
点击查看自引率趋势图>
时间预警情况
2026年03月发布的新锐学术版不在预警名单中
2025年03月发布的2025版不在预警名单中
2024年02月发布的2024版不在预警名单中
2023年01月发布的2023版不在预警名单中
2021年12月发布的2021版不在预警名单中
2020年12月发布的2020版不在预警名单中
99.61%4.48%0.43%
CiteScore：5.40
SJR：0.716
SNIP：1.489
学科类别分区排名百分位
大类：Engineering
小类：Industrial and Manufacturing Engineering
Q2
107 / 402
大类：Engineering
小类：Electrical and Electronic Engineering
Q2
262 / 970
大类：Engineering
小类：Electronic, Optical and Magnetic Materials
Q2
99 / 305

期刊高被引文献

Stochastic Collocation With Non-Gaussian Correlated Process Variations: Theory, Algorithms, and Applications
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2889266
Defect Detection in Electronic Surfaces Using Template-Based Fourier Image Reconstruction
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2873744
Design of an Area-Scalable Two-Layer Evaporator Wick for High-Heat-Flux Vapor Chambers
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2860961
Reliability Challenges in Fabrication of Flexible Hybrid Electronics for Human Performance Monitors: A System-Level Study
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2919866
Characterization of PCB Embedded Package Materials for SiC MOSFETs
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2904533
Design, Fabrication, and Characterization of a Compact Hierarchical Manifold Microchannel Heat Sink Array for Two-Phase Cooling
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2899648
Design of Balanced Filtering Components Based on Isosceles Right-Angled Triangular Patch
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2872588
Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2935477
A Wideband Resonant Cavity Antenna Assembled Using a Micromachined CPW-Fed Patch Source and a Two-Layer Metamaterial Superstrate
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2870479
Electromagnetic Characterization of the Intrachip Propagation Channel in $Ka$ - and $V$ -Bands
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2930347
Machine-Learning-Based Error Detection and Design Optimization in Signal Integrity Applications
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2916902
A Simple Simulation Approach for the Estimation of Convergence and Performance of Fully Adaptive Equalization in High-Speed Serial Interfaces
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2911177
Triple-Passband Cavity Filters With High Selectivity Under Operation of Triple Modes
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2869854
Effects of Thermal Cycling on Creep of SnAgCu Solder Joints
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2884731
A Compact Microwave Device for Fracture Diagnosis of the Human Tibia
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2893367
Process Mean of Tolerance Settings of CPU Components via CAE Simulation and Response Surface Methodology
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2879656
Analyzing Crosstalk-Induced Effects in Rough On-Chip Copper Interconnects
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2941871
Contact Resistance Model and Thermal Stability Analysis of Bolt Structure
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2877774
CFD Investigation of Airflow Management in a Small Container Data Center
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2916017
Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2926792
Wideband SIW-Based Low-Cost Multilayer Slot Antenna Array for $E$ -Band Applications
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2910385
Design of the Microstrip Bandstop Filter With High Insertion Loss
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2879898
A Comparative Study for the Junction Temperature of Green Light-Emitting Diodes
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2929172
Active Thermomechanical Stress Cancellation of Solder Joints in Surface-Mount Technology Integrated Circuits
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2870940
Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2945016
Enhancing the Structural Strength of an ODD Laptop via Six Sigma Approach
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2922728
Block Compressive Sensing for Solder Joint Images With Wavelet Packet Thresholding
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2907106
The Effect of Cable Section on the Variation of Power Automotive Connector Temperature
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2914894
Cool Interconnect: A 1024-bit Wide Bus for Chip-to-Chip Communications in 3-D Integrated Circuits
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2873298
Study on Electrical Properties of AgSnO2 Contact Materials Doped With Rare-Earth La, Ce, and Y
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2882237
Theoretical and Experimental Study on Electrical Contact Resistance of Metal Bolt Joints
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2920854
Constructive Signal Approximations for Fast Transient Simulation of Coupled Channels
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2917773
Impact of Local Stress Distribution in a Silicon Chip Mounted by Area-Arrayed Copper Pillar Wafer-Level Packaging Technology on Analog-Circuit Performance
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2901762
Assembly of Components on Inkjet-Printed Silver Structures by Soldering
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2855045
Silicon Interposer Package for MMIC Heterogeneous Integration Based on Gold/Solder Ball Flip-Chip Technique
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2917292
Multi-Material Heatsink Design Using Level-Set Topology Optimization
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2929017
Corrections to “Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes” [Jul 16 1056-1065]
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/tcpmt.2019.2918963
Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder—Part II: Electromigration Experiments
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2940566
Contour Extraction and Quality Inspection for Inner Structure of Deep Hole Components
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2873207
Through-Silicon Capacitor Interconnection for High-Frequency 3-D Microsystem
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2879977
Effective Method for Wire Bonds Rework Using Conductive Epoxy
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2878104
Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2869641
A Low-g MEMS Inertial Switch Based on Direct Contact Sensing Method
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2926332
Spreading Resistance in Flux Tubes With Variable Heat Flux and Nonuniform Convection
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2910132
Low-Loss Aerosol-Jet Printed Wideband Interconnects for Embedded Devices
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2933792
Moments-Based Parametric Sensitivity Analysis of X-Parameters
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2947588
Comparison of Wideband Interconnecting Technologies for Multigigahertz Novel Memory Architecture
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2889697
Reliability-Aware 3-D Clock Distribution Network Using Memristor Ratioed Logic
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2900851
A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2921055
3-D Printing and CNC Machining Technologies for Exploration of Circularly Polarized Patch Antenna With Enhanced Gain
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2890869

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ACTA MECHANICA封面

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学科领域：工程技术
影响因子：2.9
中科院分区： 3区
ADVANCES IN STRUCTURAL ENGINEERING封面

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学科领域：工程技术
影响因子：2.6
中科院分区： 3区
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学科领域：工程技术
影响因子：2.3
中科院分区： 3区
AIAA JOURNAL封面

AIAA JOURNAL

学科领域：工程技术
影响因子：2.8
中科院分区： 3区
论文发表 2-4个月录用 7500+文章录用 不成功可退款
新
2026年3月发布
大类学科小类学科Top期刊综述期刊
工程技术3区
ENGINEERING, MANUFACTURING 工程：制造
4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
3区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合
3区
否
N/A
2025年3月升级版
大类学科小类学科Top期刊综述期刊
工程技术3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
3区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合
3区
ENGINEERING, MANUFACTURING 工程：制造
4区
否
否
2023年12月旧的升级版
大类学科小类学科Top期刊综述期刊
工程技术3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
3区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合
3区
ENGINEERING, MANUFACTURING 工程：制造
4区
否
否