Journal of Microelectronics and Electronic Packaging

A New Halogen-Free Parylene for High Performance & Reliability of Microelectronics in Harsh Environments

Fabrication of Three-Dimensional Piezoelectric Ceramics Using the Dispenser System

Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief

Head-on-Pillow Defect Detection: X-Ray Inspection Limitations

A Wirebonding Instrument for Insulated and Coaxial Wires

Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications

Process Design Kit and Design Automation for Flexible Hybrid Electronics

Collective Cu-Cu Thermocompression Bonding Using Pillars

A Capacitive Pressure Sensor Based on Cofirable Ceramic/Glass Materials with LTCC Technology

Rapid and Localized Soldering Using Reactive Films for Electronic Applications

Experimental Studies of Electronics Cooling Capabilities at High Altitude

High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications

Development of High Thermally Conductive Die Attach for TIM Applications

Process Optimization and Implementation of Online Monitoring Process in the Transfer Molding for Electronic Packaging

FCCSP IMC Growth under Reliability Stress Following Automotive Standards

Moisture-Resistant Sealing Materials for Downhole HPHT Electrical Feedthrough Package

Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging