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JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
ISSN：1057-7157

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Microelectromechanical系统期刊
J MICROELECTROMECH S
学科领域：工程技术
是否预警：不在预警名单内
是否OA：否
录用周期：约3.0个月
新锐分区：工程技术3区
年发文量：87
影响因子：3.1
JCR分区：Q2

基本信息

Microelectromechanical系统期刊感兴趣的主题包括但不限于：尺寸范围从微米到毫米的器件、IC兼容制造技术、其他制造技术、微观现象的测量、理论结果、新材料和设计、微致动器、微机器人、微电池、轴承、磨损、可靠性、电互连、微远程操纵以及适用于MEMS的标准。在流体学、光学、生物医学工程等中的应用实例和面向应用的装置，也是人们关心的中心问题。
1057-7157SCIE/Scopus收录
3.1
点击查看最新影响趋势>
3.1
新
2026年3月发布
点击查看历史分区趋势    >
大类学科小类学科Top期刊综述期刊
工程技术3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
3区
NANOSCIENCE & NANOTECHNOLOGY 纳米科技
4区
INSTRUMENTS & INSTRUMENTATION 仪器仪表
3区
PHYSICS, APPLIED 物理：应用
3区
否
N/A
新
WOS期刊SCI分区  2024-2025最新升级版
按JIF指标学科分区收集子录JIF分区JIF排名百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC
SCIE
Q2
152/368
学科：INSTRUMENTS & INSTRUMENTATION
SCIE
Q2
29/79
学科：NANOSCIENCE & NANOTECHNOLOGY
SCIE
Q3
91/147
学科：PHYSICS, APPLIED
SCIE
Q2
75/187
按JCR指标学科分区收集子录JCR分区JCR排名百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC
SCIE
Q2
167/368
学科：INSTRUMENTS & INSTRUMENTATION
SCIE
Q2
35/79
学科：NANOSCIENCE & NANOTECHNOLOGY
SCIE
Q2
72/147
学科：PHYSICS, APPLIED
SCIE
Q2
77/187
131
87
点击查看年发文量趋势图>
15%较易约3.0个月-工程技术-工程：电子与电气
9.7%
点击查看自引率趋势图>
时间预警情况
2026年03月发布的新锐学术版不在预警名单中
2025年03月发布的2025版不在预警名单中
2024年02月发布的2024版不在预警名单中
2023年01月发布的2023版不在预警名单中
2021年12月发布的2021版不在预警名单中
2020年12月发布的2020版不在预警名单中
100.00%7.17%0.5%
CiteScore：6.20
SJR：0.592
SNIP：1.320
学科类别分区排名百分位
大类：Engineering
小类：Mechanical Engineering
Q1
154 / 720
大类：Engineering
小类：Electrical and Electronic Engineering
Q1
221 / 970

期刊高被引文献

Resonant Microelectromechanical Receiver
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2898984
A Resonant MEMS Accelerometer With 56ng Bias Stability and 98ng/Hz1/2 Noise Floor
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2908931
Utilizing Energy Localization in Weakly Coupled Nonlinear Resonators for Sensing Applications
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2894953
Piezoelectric Pressure Sensors for Hypersonic Flow Measurements
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2899266
Analysis of Thermally Actuated RF-MEMS Switches for Power Limiter Applications
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2018.2881128
High-Accuracy Ultrasonic Rangefinders via pMUTs Arrays Using Multi-Frequency Continuous Waves
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2912869
Precision Plating of Human Electrogenic Cells on Microelectrodes Enhanced With Precision Electrodeposited Nano-Porous Platinum for Cell-Based Biosensing Applications
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2018.2879577
Study of Energy Loss Mechanisms in AlN-Based Piezoelectric Length Extensional-Mode Resonators
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2913875
Design and Modeling of Piezoelectrically Driven Micro-Actuator With Large Out-of-Plane and Low Driving Voltage for Micro-Optics
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2935007
Capacitive MEMS Accelerometer With Perforated and Electrically Separated Mass Structure for Low Noise and Low Power
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2903349
Highly-Linear Magnet-Free Microelectromechanical Circulators
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2947903
A CMOS-Integrated MEMS Platform for Frequency Stable Resonators-Part I: Fabrication, Implementation, and Characterization
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2936149
Theoretical Modeling, Numerical Simulations and Experimental Study of Micro Thermal Convective Accelerometers
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2930065
Development of 3D Fused Quartz Hemi-Toroidal Shells for High-Q Resonators and Gyroscopes
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2945713
A Two-Terminal Bistable Electrothermally Actuated Microswitch
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2904997
A Multifunctional Smart Soft Contact Lens Device Enabled by Nanopore Thin Film for Glaucoma Diagnostics and In Situ Drug Delivery
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2927232
Ultra-Thick Electroplated CoPt Magnets for MEMS
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2018.2888846
Formation, Evolution, and Tuning of Frequency Combs in Microelectromechanical Resonators
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2898003
Shape Memory Alloy Actuators for Silicon Microgrippers
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2936288
Semi-Packed Gas Chromatography Columns With Density Modulated Pillars
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2018.2881532
Extended Design Space of Silicon-on-Nothing MEMS
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2927466
T-Shaped Piezoelectric Structure for High-Performance MEMS Vibration Energy Harvesting
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2942291
An Adjustable Magnetic Preloading and Stepping Controlled Piezoelectric Traveling-Wave Ultrasonic Micromotor
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2018.2889864
Manipulation of Liquid Metal Inside an SEM by Taking Advantage of Electromigration
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2018.2878320
Focusing of Airborne Particles Using Groove-Induced Envelope (GRIP) Flow Air-Microfluidic Concentrator
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2898630
Design, Fabrication, and Characterization of Bimorph Micromachined Harvester With Asymmetrical PZT Films
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2920213
Feasibility Studies on Nafion Membrane Actuated Micropump Integrated With Hollow Microneedles for Insulin Delivery Device
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2939189
A CMOS-Integrated MEMS Platform for Frequency Stable Resonators—Part II: Design and Analysis
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2936146
Highly Accurate Airflow Volumetric Flowmeters via pMUTs Arrays Based on Transit Time
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2916987
Batch Fabrication of Miniaturized Ag/AgCl Reference Electrode With Ion Exchanging Micro-Nano-Pores by Silicon-Base Double-Side Anisotropic Etching Process
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2936651
MEMS-Based AlScN Resonating Energy Harvester With Solidified Powder Magnet
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2945550
Fabrication of Phase Change Microstring Resonators via Top Down Lithographic Techniques: Incorporation of VO2/TiO2 Into Conventional Processes
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2931805
CMOS Closed-Loop Control of MEMS Varactors for Robust Ka-Band Tunable Filters
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2929469
Symmetric LC Circuit Configurations for Passive Wireless Multifunctional Sensors
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2901818
Etching Mechanisms of SiO2 and SiNx:H Thin Films in HF/Ethanol Vapor Phase: Toward High Selectivity Batch Release Processes
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2918738
Multiscale Fluidic Channels via Internal Oxidation and Oxide Etching of Self-Assembled Silicon-on-Nothing Structures
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2926378
Optically Accessible MEMS Resonant Mass Sensor for Biological Applications
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2906586
CMOS Compatible Hermetic Packages Based on Localized Fusion Bonding of Fused Silica
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2913533
MEMS Tunable Photonic Crystal-Cantilever Cavity
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2936450
Thick High Aspect-Ratio Biomimetic Silicon Hair Sensors as Accelerometers
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2018.2884524
A Novel Indirect Quasi-Static Actuation Concept for 2D MEMS Micromirrors
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2897755
A Technique for Estimation of Residual Stress and Young’s Modulus of Compressively Stressed Thin Films Using Microfabricated Beams
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2948016
A Shear-Stress Sensor for Hypersonic Flow Measurement
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2899256
Continuous Single-Phase Flow-Assisted Isolation for Parallel Observation of Reactions Between Deterministically Paired Particles
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2927885
Bending Deformation of Multiple Aligned Plates Toward Coalescence Induced by Capillarity
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2913012
Real-Time Monitoring for Knee Extensor Muscle Training With Flexible Sensors
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2941939
A Passive Wireless Switching Array Based on MEMS Switches
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2938545
Thermoformed Liquid Crystal Polymer Packages for Magnetoelastic Frame-Suspended Resonators
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2904711
Thermally Reflowed Die-Attached Linear Variable Optical Filter for Mid-Infrared Volatile Organic Compounds Detection
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2936006
Development and Modeling of a Wafer-Level BCB Packaging Method for Capacitive RF MEMS Switches
来源期刊：Journal of Microelectromechanical SystemsDOI：10.1109/JMEMS.2019.2912745

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学科领域：工程技术
影响因子：2.9
中科院分区： 3区
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学科领域：工程技术
影响因子：2.6
中科院分区： 3区
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学科领域：工程技术
影响因子：2.3
中科院分区： 3区
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学科领域：工程技术
影响因子：2.8
中科院分区： 3区
论文发表 2-4个月录用 7500+文章录用 不成功可退款
新
2026年3月发布（新锐分区）
大类学科小类学科Top期刊综述期刊
工程技术3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
3区
NANOSCIENCE & NANOTECHNOLOGY 纳米科技
4区
INSTRUMENTS & INSTRUMENTATION 仪器仪表
3区
PHYSICS, APPLIED 物理：应用
3区
否
N/A
2025年3月升级版
大类学科小类学科Top期刊综述期刊
工程技术3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
3区
INSTRUMENTS & INSTRUMENTATION 仪器仪表
3区
NANOSCIENCE & NANOTECHNOLOGY 纳米科技
3区
PHYSICS, APPLIED 物理：应用
3区
否
否
2023年12月旧的升级版
大类学科小类学科Top期刊综述期刊
工程技术3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气
3区
INSTRUMENTS & INSTRUMENTATION 仪器仪表
3区
PHYSICS, APPLIED 物理：应用
3区
NANOSCIENCE & NANOTECHNOLOGY 纳米科技
4区
否
否